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Tegal T901

Tegal T901

Tegal T901
Plasma Etch System
Wafer Size 6"
Single-wafer Dry Etch of Polysilicon, Nitride, Silicon Oxide
The Tegal 901 plasma dry etch semiconductor equipment are used by the semiconductor industry for integrated circuit fabrication. The Tegal 901 plasma etcher plasma etch semiconductor equipment are used in one part of the sequence of manufacturing steps that transfer a pattern formed from a layer of photosensitive material, the photoresist, to a layer that makes up a permanent part of the finished device.
Wafers in the Tegal 901 plasma dry etch semiconductor equipment are transported to a Reaction Chamber. A gas mixture is introduced into the Reaction Chamber, and the gas mixture is caused to become reactive by the application of radio frequency (RF) electromagnetic radiation. The reactive mixture, or plasma, etches away material that is not covered by the masking photoresist. The etch process is terminated at an appropriate time, the wafer is unloaded from the Reaction Chamber, and a new wafer is introduced. The cycle repeats.
The Tegal 901 plasma dry etch semiconductor equipment Plasma/RlE etchers have been configured to take advantage of the characteristics of plasmas for etching various films. Each of the models in the 90Xe family have been optimized for specific etches of specific films. All models have the common ability to implement multi-step etch recipes using multiple process gases. An optical monitoring system provides a means for determining etch completion so that the etch process may be terminated.
  • Localité : Lyon (69000)
  • Marque : Tegal
  • Modèle : T901
  • Accessoires : On Demand
  • Matériel transportable : Oui
  • Pays d'émission du matériel : France

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